SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N0071 Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBRF1060CTP

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

°C

0.70

V

Max. Forward Voltage Drop

(per leg)*

°C

0.65

V

Max. Reverse Current at DC

condition (per leg)

1.0

mA

Max. Reverse Current (per

leg)*

15

mA

Max. Junction Capacitance

(per leg)

220

pF

Typical Series Inductance

(per leg)

Measured lead to lead 5 mm from

package body

8.0

nH

Max. Voltage Rate of Change

dv/dt

-

10,000

V/

µs

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

°C)

Screw mounting, the epoxy body

is inside the heatsink.

1500

V

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature Range

-

-55 to +150

°C

Storage Temperature Range

-

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

(per leg)

DC operation

3.5

°C/W

Approximate Weight

wt

-

2

g

Case Style

ITO-220AB