HCPL-623X datasheet(3/12 Pages) HP

3 / 12 page

Functional Diagrams

8 Pin DIP

16 Pin Flat Pack

20 Pad LCCC

Through Hole

Unformed Leads

Surface Mount

1 Channel

2 Channels

4 Channels

2 Channels

Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless

ceramic chip carrier) package has isolated channels with separate VCC and ground connections.

VCC

GND

Outline Drawings

16 Pin Flat Pack, 4 Channels

VCC

VO1

GND

VO2

8 Pin DIP Through Hole, 1 and 2 Channel

20 Terminal LCCC Surface Mount, 2 Channels

GND

VO4

VO3

VCC

VO2

VO1

GND1

VO2

VO1

VCC2

VCC1

GND2

8.13 (0.320)

MAX.

5.23

(0.206)

MAX.

2.29 (0.090)

MAX.

7.24 (0.285)

6.99 (0.275)

1.27 (0.050)

REF.

0.46 (0.018)

0.36 (0.014)

11.13 (0.438)

10.72 (0.422)

2.85 (0.112)

MAX.

0.89 (0.035)

0.69 (0.027)

0.31 (0.012)

0.23 (0.009)

0.88 (0.0345)

MIN.

9.02 (0.355)

8.76 (0.345)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

1.78 (0.070)

2.03 (0.080)

1.02 (0.040) (3 PLCS)

4.95 (0.195)

5.21 (0.205)

8.70 (0.342)

9.10 (0.358)

1.78 (0.070)

2.03 (0.080)

0.51 (0.020)

0.64

(0.025)

(20 PLCS)

1.52 (0.060)

2.03 (0.080)

METALIZED

CASTILLATIONS (20 PLCS)

2.16 (0.085)

TERMINAL 1 IDENTIFIER

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

SOLDER THICKNESS 0.127 (0.005) MAX.

1.14 (0.045)

1.40 (0.055)

3.81 (0.150)

MIN.

4.32 (0.170)

MAX.

9.40 (0.370)

9.91 (0.390)

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MIN.

0.76 (0.030)

1.27 (0.050)

8.13 (0.320)

MAX.

7.36 (0.290)

7.87 (0.310)

0.20 (0.008)

0.33 (0.013)

7.16 (0.282)

7.57 (0.298)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

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