1-52

Insulation and Safety Related Specifications

8-Pin DIP

Widebody

(300 Mil)

SO-8

(400 Mil)

Parameter

Symbol

Value

Value

Value

Units

Conditions

Minimum External

L(101)

7.1

4.9

9.6

mm

Measured from input terminals

Air Gap (External

to output terminals, shortest

Clearance)

distance through air.

Minimum External

L(102)

7.4

4.8

10.0

mm

Measured from input terminals

Tracking (External

to output terminals, shortest

Creepage)

distance path along body.

Minimum Internal

0.08

0.08

1.0

mm

Through insulation distance,

Plastic Gap

conductor to conductor, usually

(Internal Clearance)

the direct distance between the

photoemitter and photodetector

inside the optocoupler cavity.

Minimum Internal

NA

NA

4.0

mm

Measured from input terminals

Tracking (Internal

to output terminals, along

Creepage)

internal cavity.

Tracking Resistance

CTI

200

200

200

Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative

Tracking Index)

Isolation Group

IIIa

IIIa

IIIa

Material Group

(DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

Regulatory Information

The devices contained in this data

sheet have been approved by the

following organizations:

UL

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

VDE

Approved according to VDE

0884/06.92 (HCNW4506 and

HCPL-4506 Option 060 only).

BSI

Certification according to

BS451:1994

(BS EN60065:1994);

BS EN60950:1992

(BS7002:1992) and

EN41003:1993 for Class II

applications (HCNW4506 only).

Note: Use of nonchlorine activated fluxes is recommended.

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12

Solder Reflow Temperature Profile