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SSFD3004 bảng dữ liệu(PDF) 2 Page - Silikron Semiconductor Co.,LTD. |
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SSFD3004 bảng dữ liệu(HTML) 2 Page - Silikron Semiconductor Co.,LTD. |
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2 / 7 page ![]() SSFD3004 ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit OFF CHARACTERISTICS Drain-Source Breakdown Voltage BV V =0V I DSS GS D=250μA 30 V Zero Gate Voltage Drain Current I V =30V,V =0V 1 μA DSS DS GS Gate-Body Leakage Current I V =±20V,V =0V ±100 nA GSS GS DS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V V =V GS(th) DS GS,ID=250μA 1 1.8 2.5 V V =4.5V, I GS D=20A 7.5 9.5 mΩ Drain-Source On-State Resistance RDS(ON) V =10V, I GS D=30A 4.4 5.5 mΩ Forward Transconductance g V =5V,I FS DS D=30A 25 S DYNAMIC CHARACTERISTICS (Note4) Input Capacitance C 1800 PF lss Output Capacitance Coss 450 PF V =15V,V Reverse Transfer Capacitance Crss DS GS=0V, F=1.0MHz 300 PF SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time t 8 nS d(on) Turn-on Rise Time t 10 nS r Turn-Off Delay Time td(off) 30 nS V =15V,V =10V,R Turn-Off Fall Time tf DS GS GEN=3Ω ID=1A 9 nS Total Gate Charge Q 30 nC g Gate-Source Charge Qgs 5 nC V =15V,I Gate-Drain Charge Qgd DS D=10A,VGS=10V 9 nC DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) V V =0V,I =1A 0.7 1.2 V SD GS S NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on 1in2 FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production testing. 5. Limited by TJmax, starting TJ = 25°C, L = 0.3mH RG =50Ω, IAS = 50A, VGS =10V. Part not recommended for use above this value ©Silikron Semiconductor CO.,LTD. 2 http://www.silikron.com v2.0 |
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