XFMRS

XFMRS, INC.

1940 Landersdale Road • Camby, Indiana 46113 • Tel. (317) 834-1066 • Fax: (317) 834-1067

XFMRS

15

Operating temperature

- 25 to + 85°C [ - 13 to + 185°F]

range

n RELIABILITY AND TEST CONDITIONS

Item

Test conditions

Storage temperature

- 40 to + 85°C [ - 40 to + 185°F]

range

0 to 60°C [32 to 140°F] (in tape and reel packaging)

Soldering heat resistance

The chip should not crack. More than 75% of the

terminal electrode should be covered with solder.

Preheat: 120 to 150°C [248 to 320°F] for 60 seconds

Solder: H63A (eutectic solder)

Solder temperature: 300+/- 5°C [572 +/- 9°F]

Flux: Rosin

Dip time: 10 +/- 0.5 seconds

Solderability

More than 90% of the terminal electrode should

be covered with new solder.

Preheat: 120 to 150°C [248 to 302°F] for 60 seconds

Solder: H63A (eutectic solder)

Solder temperature: 230+/- 5°C [446 +/- 9°F]

Flux: Rosin

Dip time: 3 +/- 1 seconds

Terminal strength

The terminal electrode should not break off nor

the ferrite damaged.

Bending strength

The ferrite should not be damaged by forces

applied on the right.

Thermal shock

No mechanical damage. Inductance

(Temperature cycle)

should be within +/- 5% of the intitial

High temperature

value and Q (shall be) within +/- 30%

resistance

of the initial value.

Temperature: -25°C [-13°F], +85°C [+185°F] for

30 minutes each, 50 cycles.

Applied 200mAdc and placed at 80°C [176°F] for 500

hours, then measured at room ambient temperature.

Applied 200mAdc and placed at 90%RH, 60°C

[140°F] for 500 hours, then measured at room ambient

temperature.

Drop 10 times on a concrete floor from a height of 1 m

[39.370 inches]

Solvent: Trichloroethylene

Washer: Ultrasonic washer (100W)

Washing time: 3 minutes

Humidity resistance

Drop

Solvent resistance

Type

W(N) [kgf]

Time (sec.)

XFEI 2012

5.9 [0.6]

XFEI 3216

9.8 [1.0]

30 +/- 5S

Type

A(mm) [inches]

P (N) (Kgf)

XFEI 201209

1.4 [.055]

9.8 [1.0]

XFEI 321611

2.0 [.079]

19.6 [2.0]