STPS2H100UF datasheet(5/12 Pages) STMICROELECTRONICS

5 / 12 page

DocID6115 Rev 8

5/12

STPS2H100

Characteristics

Figure 13. Forward voltage drop versus forward

current (low level)

Figure 14. Forward voltage drop versus forward

current (high level)

(A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

j=25°C

(Maximum values)

j=125°C

(Maximum values)

j=125°C

(Maximum values)

j=125°C

(Typical values)

j=125°C

(Typical values)

(V)

(A)

100

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

j=25°C

(Maximum values)

j=125°C

(Maximum values)

j=125°C

(Maximum values)

j=125°C

(Typical values)

j=125°C

(Typical values)

(V)

Figure 15. Thermal resistance junction to

ambient versus copper surface under each lead

(SMA)

Figure 16. Thermal resistance junction to

ambient versus copper surface under each lead

(SMAflat)

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

(cm²)

SMA

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

(°C/W)

th(j-a)

100

120

140

160

180

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMAflat

(cm²)

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

Figure 17. Thermal resistance junction to

ambient versus copper surface under each lead

(SMB)

Figure 18. Thermal resistance junction to

ambient versus copper surface under each lead

(SMBflat)

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

(cm²)

SMB

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

(cm²)

SMBflat

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

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