IXYS reserves the right to change limits, test conditions and dimensions

© 2010 IXYS All rights reserved

IXYS KOREA LTD.

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IXYS Corporation

906-5 Iui-dong, Yeongtong-Gu, Suwon, Gyeonggi-Do (Korea)

1590 Buckeye Drive, Milpitas, CA 95035-7418

Phone +82-31-888-5232, Fax +82-31-888-5233

Rev. Jan. 2011

Phone (408) 457-9000, Fax 408-496-0670

Front-side View

Cell Size

Front-side View details

Back-side View details

Moisture Sensitivity, Reflow Soldering and Washing Information

IXYS has characterized the moisture reflow sensitivity of the SolarMD using IPC/JEDEC standard J-STD-020. Moisture uptake from

atmospheric humidity occurs by diffusion. During the solder reflow process, in which the component is attached to the PCB, the whole

body of the component is exposed to high process temperatures. The combination of moisture uptake and high reflow soldering

temperatures may lead to moisture induced delamination and cracking of the component. To prevent this, this component must be

handled in accordance with IPC/JEDEC standard J-STD-020 per the labeled moisture sensitivity level (MSL), level 1. IXYS does not

recommend the use of chlorinated solvents.

Surface Protection Film

Please be advised that SLMD module is normally covered with protection film by factory to prevent it from scratch or dirt during the

transportation, Therefore it is highly recommended to remove the protection film at the end of your work. Especially when SLMD

should go through the high temperature process or environment, the film should be removed in advance. If protection film is not

wanted, please consult with us.