Notes:

(1) Measured at 1.0MHz and applied reverse voltage of 4.0 VDC

(2) Thermal resistance from junction to ambient on P.C. Board Mounted

Characteristic

Symbols

DF005

DF01

DF02

DF04

DF06

DF08

DF10

Units

Maximum repetitive peak reverse voltage

V

RRM

50

100

200

400

600

800

1000

Volts

Maximum RMS voltage

V

RMS

35

70

140

280

420

560

700

Volts

Maximum DC blocking voltage

V

DC

50

100

200

400

600

800

1000

Volts

Maximum average forward rectified current

at T

I

(AV)

1.0

Amp

Peak forward surge current

8.3mS single half sine-wave superimposed

on rated load

I

FSM

50.0

Amps

Maximum forward voltage at

forward current perelement 1.0A

V

F

1.1

Volts

Maximum DC reverse current

T

at rated DC blocking voltage

T

I

R

10.0

500.0

A

Typical junction capacitance (Note 1)

C

J

25.0

F

Typical thermal resistance (Note 2)

R

JA

40.0

/W

Operating temperature range

T

J

-55 to +125

Storage temperature range

T

STG

-55 to +150

Features

Mechanical Data

DF005 THRU DF10

GLASS PASSIVATED CHIP SINGLE-PHASE BRIDGE RECTIFIER

Ideal for printed circuit board

Glass passivated chip junction

High temperature soldering guaranteed:

260 /10 seconds at 5 lbs tension

Terminals: Plated leads, solderable per

MIL-STD-202, method 208

Case: Molded with UL-94Class V-0 recognized

flame retartant epoxy

Polarity: Polarity symbol marked on body

Mounting Position: Any

Maximum Ratings and Electrical Characteristics

1

Single-phase, half-wave, 60Hz, resistive or inductive load.

Ratings at 25

unless otherwise stated.

For capacitive load, Derate current by 20%.