LP3907 datasheet(7/57 Pages) TI1

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LP3907

www.ti.com

SNVS511N – JUNE 2007 – REVISED AUGUST 2011

Operating Ratings: Bucks

(1) (2) (3) (4)

VIN

2.8V to 5.5V

VEN

0 to (VIN + 0.3V)

Junction Temperature (TJ) Range

−40°C to +125°C

Ambient Temperature (TA) Range

(5)

−40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the

most likely norm.

(4)

Buck VIN ≥ VOUT + 1V.

(5)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

Thermal Properties

(6) (7) (8)

Junction-to-Ambient Thermal Resistance (

θJA) SQA024AE

28°C/W

Junction-to-Ambient Thermal Resistance (

θJA) TLA25AAA

51°C/W

(6)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 140°C (typ.)

(7)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (θJA × PD-MAX). See Applications section.

(8)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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