Oplink Communications, Inc.

Electrical Pad Layout

Host Board Connector Pad Layout

Toward

Bezel

Toward

ASIC

20

19

18

17

16

15

14

13

12

11

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

TX GND

TD- (TX DATA IN-)

TD+ (TX DATA IN+)

TX GND

VccTX

VccRX

RX GND

RD+ (RX DATA OUT+)

RD- (RX DATA OUT-)

RX GND

Pin 2 Internally Grounded.

1

2

3

4

5

6

7

8

9

10

TX GND

TX Fault

TX Disable

MOD_DEF(2)

MOD_DEF(1)

MOD_DEF(0)

NO CONNECTION

LOS

RX GND

RX GND

Bottom of Board

(as viewed thru top of board)

Top of Board

TRPNFEMM

RevA-PN.2009.06.25

3

Parameter

Symbol

Minimum

Typical

Maximum

Units

V

PP-DIF

0.50

-

2.4

V

V

IH

2.0

-

V

CC

V

V

IL

0

-

0.8

V

1

Differential peak-to-peak voltage.

2

There is an internal 4.7 to 10kΩ pull-up resistor to VccT.

Parameter

Symbol

Minimum

Typical

Maximum

Units

V

PP-DIF

0.6

-

2.0

V

V

OH

2.0

-

V

V

V

OL

0

-

0.5

V

1

Differential peak-to-peak voltage across external 100Ω load.

2

Open collector compatible, 4.7 to 10kΩ pull-up resistor to Vcc (Host Supply Voltage).

Parameter

Symbol

Minimum

Typical

Maximum

Units

Supply Voltage

V

CC

3.13

3.3

3.47

V

Supply Current

I

CC

-

222

245

mA

MOD_DEF(0)

pin 6

MOD_DEF(1)

pin 5

MOD_DEF(2)

pin 4

Interpretation by Host

TTL LOW

SCL

SDA

Serial module definition protocol

Module Definition