1

Handling and Storage

ESD (Electrostatic Discharge)

Electrostatic discharge occurs naturally in the

environment. With the increase in voltage potential, the

outlet of neutralization or discharge will be sought. If the

acquired discharge route is through a semiconductor

device, destructive damage will result.

ESD countermeasure methods should be developed

and used to control potential ESD damage

during handling in a factory environment at each

manufacturing site.

MSL (Moisture Sensitivity Level)

Plastic encapsulated surface mount package is sensitive to

damage induced by absorbed moisture and temperature.

Avago Technologies follows JEDEC Standard J-STD 020B.

Each component and package type is classified for

moisture sensitivity by soaking a known dry package at

various temperatures and relative humidity, and times.

After soak, the components are subjected to three

consecutive simulated reflows.

Table 5. ESD Classification

Pin#

Name

Description

HBM

MM

Classification

1

Vcc1

Supply Voltage

± 2000V

± 200V

Class 2

2

RF In

RF Input

± 2000V

± 200V

Class 2

3

Vcont

Control Voltage

± 2000V

± 200V

Class 2

4

Vref

Reference Voltage

± 2000V

± 200V

Class 2

5

GND

Ground

± 2000V

± 200V

Class 2

6

GND

Ground

± 2000V

± 200V

Class 2

7

RF Out

RF Output

± 2000V

± 200V

Class 2

8

Vcc2

Supply Voltage

± 2000V

± 200V

Class 2

Note:

1. Module products should be considered extremely ESD sensitive.

The out of bag exposure time maximum limits are

determined by the classification test described above

which corresponds to a MSL classification level 6 to 1

according to the JEDEC standard IPC/JEDEC J-STD-020B

and J-STD-033.

WS1102 is MSL3. Thus, according to the J-STD-033 p.11

the maximum Manufacturers Exposure Time (MET) for

this part is 168 hours. After this time period, the part

would need to be removed from the reel, de-taped and

then re-baked.

MSL classification reflow temperature for the WS1102 is

targeted at 250°C +0/-5°C. Figure 19 and Table 7 show

typical SMT profile for maximum temperature of 250°C

+0/-5°C.

Table 6. Moisture Classification Level and Floor Life

MSLLevel

FloorLife(outofbag)atfactoryambient≤30°C/60%RHorasstated

1

2

1 year

2a

4 weeks

3

168 hours

4

72 hours

5

48 hours

5a

24 hours

6

Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label

Note:

1. The MSL Level is marked on the MSL Label on each shipping bag.