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ZXTR2012K bảng dữ liệu(PDF) 2 Page - Diodes Incorporated |
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ZXTR2012K bảng dữ liệu(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() ZXTR2012K Document number: DS36327 Rev. 1 – 2 2 of 7 www.diodes.com December 2013 © Diodes Incorporated ZXTR2012K A Product Line of Diodes Incorporated Absolute Maximum Ratings (Voltage relative to GND, @TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Input Supply Voltage VIN -0.3 to 100 V Continuous Input & Output Current IIN, IOUT 750 mA Peak Pulsed Input & Output Current IIM, IOM 2 A Maximum Voltage applied to VOUT VOUT(max) 18 V Maximum Current at VIN = 48V (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Continuous Output Current (Note 7) IOUT 60 mA Pulsed Output Current (Note 8) IOM 960 mA (Note 9) 200 Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) PD 2.3 W (Note 6) 1.1 Thermal Resistance, Junction to Ambient (Note 5) RθJA 44 °C/W (Note 6) 90 Thermal Resistance, Junction to Lead (Note 10) RθJL 8.4 Thermal Resistance, Junction to Case (Note 10) RθJC 14.6 Recommended Operating Junction Temperature Range TJ -40 to +125 °C Maximum Operating Junction and Storage Temperature Range TJ , TSTG -65 to +150 ESD Ratings (Note 11) Characteristics Symbols Value Unit JEDEC Class Electrostatic Discharge – Human Body Model ESD HBM 4000 V 3A Electrostatic Discharge – Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed VIN pad on 50mm x 50mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in steady-state. 6. Same as note 5, except mounted on 15mm x 15mm 1oz copper. 7. Same as note 5, whilst operating at VIN = 48V. Refer to Safe Operating Area for other Input Voltages. 8. Same as note 5, except measured with a single pulse width = 100µs and VIN = 48V. 9. Same as note 5, except measured with a single pulse width = 10ms and VIN = 48V. 10. RθJL = Thermal resistance from junction to solder-point (on the exposed VIN pad). RθJC = Thermal resistance from junction to the top of case. 11. Refer to JEDEC specification JESD22-A114 and JESD22-A115 . |
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