32

33

Characteristics

Performance

Direct Current

Resistance

Within the regulated resistance tolerance.

Less than ±(1%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

No evidence of mechanical damage.

No evidence of mechanical damage.

No evidence of mechanical damage.

Over 1,000M

Ω

Temperature

Characteristic

Short-time

Overload

Intermittent

Overload

Dielectric

Withstanding

Voltage

Insulation

Resistance

ΔR

ΔR

Visual

Visual

J-Grade

1

10

Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm)

1M

F-Grade

1

Ω≤R≤10MΩ:±100ppm/℃(0603±250ppm)

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

JIS C 5201-1 4.5

Voltage apply Within 5 sec.

Test temp: 20

℃, 65RH

Test board: <FIG. 1>

JIS C 5201-1 4.8

Test Temperature(

℃)

20

℃→ -55℃ / 20℃→ 125℃

T.C.R(ppm /

※

℃

Test board: <FIG. 1>

JIS C 5201-1 4.13

Apply 2.5 times rated voltage for 5 sec.

Wait 60 minutes at room temperature.

Measure the resistance value.

Test board: <FIG. 1>

JIS C 5201-1 4.13

2.5 times of rated voltage .

1 second ON, 25 second OFF.

10,000 cycles.

Test board: <FIG. 1>

JIS C 5201-1 4.7

Apply Voltage for 1 minute

0402.0603:50V

1005, 1608: 100V

Other: 500V

Max Surge

Current

Max Surge

Current

Cu

Item

Requirements Specification

Test Methods

Resistor

Resistor

Jumper

Jumper

Cu

P2

Cu

Substrate

V

Temperature

Cycle

Less than ±(1%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

No evidence of mechanical damage.

No evidence of mechanical damage.

No evidence of mechanical damage.

No evidence of mechanical damage.

No evidence of mechanical damage.

Load Life

Low Temp.

Exposure

High Temp.

Exposure

Moisture

Resistance

ΔR

ΔR

ΔR

ΔR

ΔR

Visual

Visual

Visual

Visual

Visual

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

JIS C 5201-1 4.19

Perform 100 cycles as follows.

Test Condition: -55

℃/ 30min ↔ 125℃/ 30min

sweep time: 5 min

Test board: <FIG. 1>

JIS C 5201-1 4.25

Test Voltage: rated voltage

Test temp.: 70±2

℃

Test board: <FIG. 1>

JIS C 5201-1 4.23

Dwell in -55

Stabilize for 60 minutes at room temperature.

Measure value.

Test board: <FIG. 1>

JIS C 5201-1 4.23

Dwell in 125

℃±2℃ or 155℃±2℃chamber without

temperature.

Measure value.

Test board: <FIG. 1>

JIS C 5201-1 4.14

Test Voltage: rated voltage

Test temp.: 40±2

℃

Humidity: 90~95% RH

Stabilize for 1 hrs & Measure.

Test board: <FIG. 1>

Item

Requirements Specification

Test Methods

Resistor

Resistor

Jumper

Jumper

Solderability

Coverage:

≥95% each termination.

No crack of termination parts and ceramic exposure of

surface by melting.

Less than±(1.0%+0.05

Ω)of the initialvalue.

Less than±(1%+0.05

Ω)of the initial value.

Less than±(1%+0.05

Ω)of the initial value.

No evidence of mechanical damage.

No evidence of mechanical damage.

No evidence of mechanical damage.

Bending

Test

Adhesive strength

of termination

No mechanical damage or sign of disconnection

JIS C 5201-1(4.16)

- Test strengh : 5N (500g . f), 0603 : 2N

- Test time : Applying pressure for 10 seconds

Resistance

to

Soldering

Heat

Anti-

Vibration

Test

ΔR

ΔR

ΔR

Visual

Visual

Visual

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

IEC60068-2-58

Rosin Flux: Rosin 25%, Methanol 75%

Solder Temp.: 245+5/-0

℃

Dipping time: 2±0.5 sec.(Both side dipping)

JIS C 5201-1 4.33

After soldering resistor on

the PCB, 3mm of bending shall

be applied for 10 sec.

Test board: <FIG. 2>

JIS C 5201-1 4.18

- Flow soldering :260±5℃,10 sec .max.(both side dipping)

- Reflow soldering :260±5℃, 10 sec. max.

over 230

℃, 30~40 sec.

JIS C 5201-1 4.22

2 hours each in X, Y and Z axis(total 6 hours)

10 to 55Hz sweep in 1 minute at 1.5mm amplitude.

Item

Requirements Specification

Test Methods

Resistor

Resistor

Jumper

Jumper

R230

20

3mm

500 g.f

90mm

Ω~10MΩ. In case of other resistance range, please contact us.

Time: 5~10 sec.

Time: 10 sec max.

Temp.: 260

±5℃.

Flux

Solder

Item

Specification

Dipping

ROSIN 25%, IPA 75%

Sn-3.0Ag-0.5Cu

Electrical Characteristic

Environmental Characteristic

Flow soldering Conditions

Mechanical Characteristic

The specifications and designs contained herein may be subject to change without notice.

Please contact our sales representatives or product engineers before order.

Operation

Notes

Example of land

Pattern Design

Recommended

Soldering Conditions

General Structure

General

Precision

Jumper

Low ohms

(RUT Series)

Ultra Low ohms

(RU Series)

Ultra Low Ohms

(RUK Series)

Ultra Low Ohms

(RJ Series)

Arrays

(CONVEX Type)

Arrays

(CONCAVE Type)

Arrays

(FLAT Type)

Anti-Sulfur

Resistors

Attenuator

Characteristics

Performance

Packaging

Standard

Resistance Value

P1

P1