ACT4523

Rev 7, 01-Aug-13

Innovative Power

TM

- 15 -

www.active-semi.com

Copyright © 2013 Active-Semi, Inc.

PACKAGE OUTLINE

SOP-8EP PACKAGE OUTLINE AND DIMENSIONS

SYMBOL

DIMENSION IN

MILLIMETERS

DIMENSION IN

INCHES

MIN

MAX

MIN

MAX

A

1.350

1.700

0.053

0.067

A1

0.000

0.100

0.000

0.004

A2

1.350

1.550

0.053

0.061

b

0.330

0.510

0.013

0.020

c

0.170

0.250

0.007

0.010

D

4.700

5.100

0.185

0.200

D1

3.202

3.402

0.126

0.134

E

3.800

4.000

0.150

0.157

E1

5.800

6.200

0.228

0.244

E2

2.313

2.513

0.091

0.099

e

1.270 TYP

0.050 TYP

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each

product to make sure that it is suitable for their applications. Active-Semi products are not intended or authorized for use

as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of

the use of any product or circuit described in this datasheet, nor does it convey any patent license.

Active-Semi and its logo are trademarks of Active-Semi, Inc. For more information on this and other products, contact

is a registered trademark of Active-Semi.

Note:

1.

Lead Coplanarity is 0.1mm max.

2.

Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed

0.15mm per end.

3.

Dimension E does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.

4.

For the package reflow, 3x IR reflow is the maximum allowable reflow times for the SOP-8 standard and EP package families

during the board mounting process.