LM4510SDEV datasheet(3/23 Pages) TI1

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LM4510

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SNVS533C – SEPTEMBER 2007 – REVISED MAY 2013

Pin Descriptions (continued)

Name

Description

Output voltage feedback connection.

N/C

No internal connection.

VOUT

Internal PMOS source connection for synchronous rectification.

DAP

Die Attach Pad thermal connection

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VIN

−0.3V to 6.5V

VOUT

−0.3V to 21V

SW(4)

−0.3V to VOUT+0.3V

EN, SS, COMP FB

−0.3V to 6.5V

PGND to AGND

−0.2V to 0.2V

Continuous Power Dissipation(5)

Internally Limited

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range (TS)

−65°C to +150°C

Lead Temperature

(Soldering, 10 sec)(6)

260°C

ESD Ratings(7)

Human Body Model

2.0kV

Machine Model

200V

(1)

Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the

device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

This condition applies if VIN < VOUT. If VIN > VOUT, a voltage greater than VIN + 0.3V should not be applied to the VOUT or VSW pins.

The absolute maximum specification applies to DC voltage. An extended negative voltage limit of -1V applies for a pulse of up to 1 µs,

and -2V for a pulse of up to 40 ns. An extended positive voltage limit of 22V applies for a pulse of up to 20 ns.

(5)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (Typ.) and

disengages at TJ=140°C (Typ.).

(6)

For detailed soldering information and specifications, please refer to Application Note 1187: Leadless Leadframe Package (SON) ,

available at www.national.com.

(7)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin (MIL-STD-883 3015.7). The machine

model is a 200 pF capacitor discharged directly into each pin.

Operating Conditions

Supply Voltage Range (VIN)

2.7V to 5.5V

Junction Temperature Range (TJ)

(1)

−40°C to +125°C

Output Voltage Range (VOUT)

Up to 18V

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX)

Thermal Properties

Junction to Ambient Thermal Resistance (

θJA) SON-10 Package

(1)

36°C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken by a numerical analysis conforming to JEDEC standards. In applications where

high maximum power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation issues when designing the

board layout. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (SON).

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