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AOB12N50L bảng dữ liệu(PDF) 2 Page - Alpha & Omega Semiconductors |
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AOB12N50L bảng dữ liệu(HTML) 2 Page - Alpha & Omega Semiconductors |
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2 / 6 page ![]() AOT12N50/AOB12N50/AOTF12N50 Symbol Min Typ Max Units 500 600 BVDSS /∆TJ 0.54 V/ oC 1 10 IGSS Gate-Body leakage current ±100 n Α VGS(th) Gate Threshold Voltage 3.3 3.9 4.5 V RDS(ON) 0.36 0.52 Ω gFS 16 S VSD 0.72 1 V IS Maximum Body-Diode Continuous Current 12 A ISM 48 A Ciss 1089 1361 1633 pF Coss 134 167 200 pF Crss 10 12.6 15 pF Rg 1.8 3.6 5.4 Ω Qg 30.7 37 nC Qgs 7.6 9 nC Qgd 13.0 16 nC tD(on) 29 35 ns tr 69 83 ns tD(off) 82 98 ns Static Drain-Source On-Resistance VGS=10V, ID=6A Reverse Transfer Capacitance VGS=0V, VDS=25V, f=1MHz SWITCHING PARAMETERS IS=1A,VGS=0V VDS=40V, ID=6A Forward Transconductance Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions VDS=5V ID=250µA VDS=400V, TJ=125°C Zero Gate Voltage Drain Current IDSS Zero Gate Voltage Drain Current VDS=500V, VGS=0V Turn-Off DelayTime VGS=10V, VDS=250V, ID=12A, RG=25Ω Gate resistance VGS=0V, VDS=0V, f=1MHz Total Gate Charge VGS=10V, VDS=400V, ID=12A Gate Source Charge Turn-On Rise Time Gate Drain Charge BVDSS Maximum Body-Diode Pulsed Current Input Capacitance Output Capacitance Turn-On DelayTime DYNAMIC PARAMETERS ID=250µA, VGS=0V Diode Forward Voltage µA VDS=0V, VGS=±30V V Drain-Source Breakdown Voltage ID=250µA, VGS=0V, TJ=25°C ID=250µA, VGS=0V, TJ=150°C tD(off) 82 98 ns tf 55.5 67 ns trr 231 277 ns Qrr 2.82 3.4 µC THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Body Diode Reverse Recovery Time IF=12A,dI/dt=100A/µs,VDS=100V Turn-Off DelayTime RG=25Ω Turn-Off Fall Time Body Diode Reverse Recovery Charge IF=12A,dI/dt=100A/µs,VDS=100V A. The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation P D is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature T J(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial T J =25°C. D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating. G. L=60mH, I AS=5.5A, VDD=150V, RG=25Ω, Starting TJ=25°C Rev.8.0: April 2014 www.aosmd.com Page 2 of 6 |
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