• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

1

GaAs DPDT Switch

DC - 2.0 GHz

Rev. V3

MASW2040

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

• Cascadable

• Low Insertion Loss

• Low DC Power Consumption

• Low Distortion Operation (Quiet Mode)

• Useful as a Building Block for

-Digital Attenuators

-Digital Delay Lines

-Digital Phase Shifters

-Digital Switched Filter Elements

Description

M/A-COM’s MASW2040 is a GaAs MMIC DPDT

switch die. The MASW2040 is ideally suited for use

where low power consumption is required.

Typical

applications

include

transmit/receive

switching, switch matrices, and switched filter banks

in systems such as radio and cellular equipment,

PCM, GPS, fiber optic modules, and other battery

powered radio equipment.

Ordering Information

Part Number

Package

MASW2040

DIE

Pad Layout

Parameter

Absolute Maximum

Control Value (A or B)

-8.5 Vdc

Storage Temperature

-65°C to +175°C

Max Operating Temperature

+175°C

Max Input RF Power

+34 dBm

Absolute Maximum Rating

1,2

1. Exceeding any one or combination of these limits may cause

permanent damage to this device.

2. M/A-COM does not recommend sustained operation near

these survivability limits.

Die Size—Inches (mm)

0.043 x 0.037 x 0.010 (1.10 x 0.94 x 0.25)

Schematic

Bond Pad Dimensions

Bond Pad

Dimensions - Inches (mm)

RF1, RF2

0.004 x 0.007 (0.102 x0.182)

RFA1, RFB1

0.005 x 0.004 (0.133 x 0.100)

RFA2, RFB2

0.005 x 0.004 (0.133 x 0.100)

A, B, Ac, Bc

0.004 x 0.004 (0.100 x 0.100)

RFA1

RFA2

RFB1

RFB2