L6226

Thermal management

Doc ID 9452 Rev 4

23/31

7

Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be deliver by the device in a safe operating condition. Therefore, it has to be

taken into account very carefully. Besides the available space on the PCB, the right package

should be chosen considering the power dissipation. Heat sinking can be achieved using

copper on the PCB with proper area and thickness. Figure 21, 22 and 23 show the junction-

to-ambient thermal resistance values for the PowerSO36, PowerDIP24 and SO24 packages.

For instance, using a PowerSO package with copper slug soldered on a 1.5 mm copper

about 35°C/W. Figure 20 shows mounting methods for this package. Using a multi-layer

board with vias to a ground plane, thermal impedance can be reduced down to 15°C/W.

Figure 20.

Mounting the PowerSO package

Figure 21.

PowerSO36 junction-amb. thermal resistance vs on-board copper area