KMPC8315CVRAGDA datasheet(76/106 Pages) FREESCALE

tên linh kiện	KMPC8315CVRAGDA

Giải thích chi tiết về linh kiện	PowerQUICC II Pro Processor Hardware Specifications

PDF	106 Pages

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MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

Package and Pin Listings

This figure shows the TDM transmit signal timing.

Figure 60. TDM Transmit Signals

23 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8315E is available in

a thermally enhanced plastic ball grid array (TEPBGA II), see Section 23.1, “Package Parameters for the

MPC8315E TEPBGA II,” and Section 23.2, “Mechanical Dimensions of the TEPBGA II,” for information

on the TEPBGA II.

23.1

Package Parameters for the MPC8315E TEPBGA II

The package parameters are as provided in the following list. The package type is 29 mm

 29 mm,

TEPBGA II.

Package outline

29 mm

 29 mm

Interconnects

620

Pitch

1 mm

Module height (typical)

2.23 mm

Solder balls

96.5 Sn/3.5 Ag (VR package)

Ball diameter (typical)

0.6 mm

TDMxTCK

TDMxTD

TDMxRCK

TDMxTFS (output)

TDMxTFS (input)

tDM

tDM_HIGH

tDM_LOW

tDMIVKH

tDM_OUTAC

tDMFSIXKH

tDMTKHOV

tDMTKHOX

tDM_OUTHI

tDMFSKHOV

tDMFSKHOX

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