PS9713

RECOMMENDED SOLDERING CONDITIONS

Recommended Temperature Profile of Infrared Reflow

(1) Infrared reflow soldering

•

Peak reflow temperature

235 ˚C (package surface temperature)

•

Time of temperature higher than 210 ˚C

30 seconds or less

•

Number of reflows

Three

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a max. chlorine content of 0.2 Wt % is recommended

(2) Dip soldering

•

Temperature

260 ˚C or below (molten solder temperature)

•

Time

10 seconds or less

•

Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

•

Flux

Rosin flux containing small amount of chlorine (The flux with a max. chlorine

content of 0.2 Wt % is recommended.)

(3) Cautions

•

Fluxes

Avoid removing the residual flux with freon-based and chlorine-based

cleaning solvent.

Time (s)

100 to 160

60 to 120 s

(preheating)

(heating)

to 10 s

to 30 s

235

210

EXCLUSIVE NORTH AMERICAN AGENT FOR

RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

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08/30/2001

DATA SUBJECT TO CHANGE WITHOUT NOTICE