Product Specification

SP43701

Page 5 of 12

8

7

6

5

4

3

2

1

24

23

22

21

20

19

18

17

32

31

30

29

28

27

26

25

16

15

14

13

12

11

10

9

Exposed

Solder pad

NC

P/S

A0

GND

GND

RF1

GND

CLK

LE

A1

A2

GND

GND

RF2

GND

Electrostatic Discharge (ESD) Precautions

When handling this CMOS device, observe the

same precautions that you would use with other ESD-

sensitive devices. Although this device contains

circuitry to protect it from damage due to ESD,

precautions should be taken to avoid exceeding the

specified rating.

Exposed Solder Pad Connection

The exposed solder pad on the bottom of the package

must be grounded for proper device operation.

Figure 18. Pin Configuration (Top View)

Latch-Up Avoidance

Unlike conventional CMOS devices, SIPAT's CMOS

devices are immune to latch-up.

Switching Frequency

The SP43701 has a maximum 25 kHz switching rate.

Switching rate is defined to be the speed at which the

DSA can be toggled across attenuation states.

Pin No.

Pin Name

Description

1

N/C

No Connect

2

Power supply pin

3

P/S

Serial/Parallel mode select

4

A0

Address Bit A0 (LSB)

5, 6, 8-17,

19, 20

GND

Ground

7

RF1

RF1 port

18

RF2

RF2 port

21

A2

Address Bit A2

22

A1

Address Bit A1

23

LE

Latch Enable input

24

CLK

Serial interface clock input

25

SI

Serial Interface input

26

C16

Attenuation control bit, 16 dB

27

C8

Attenuation control bit, 8 dB

28

C4

Attenuation control bit, 4 dB

29

C2

Attenuation control bit, 2 dB

30

C1

Attenuation control bit, 1 dB

31

C0.5

Attenuation control bit, 0.5 dB

32

C0.25

Attenuation control bit, 0.25 dB

Paddle

GND

Ground for proper operation

Table 2. Pin Descriptions

Moisture Sensitivity Level

The Moisture Sensitivity Level rating for the SP43701 in

the 5x5 QFN package is MSL1.

Tel: +86-23-62808818

Fax: +86-23-62805284

www.sipatsaw.com / sawmkt@sipat.com