MTP2955L3 datasheet(2/8 Pages) CYSTEKEC

2 / 8 page

CYStech Electronics Corp.

Spec. No. : C733L3

Issued Date : 2012.02.14

Revised Date :

Page No. : 2/8

MTP2955L3

CYStek Product Specification

Thermal Data

Parameter

Symbol

Value

Unit

Thermal Resistance, Junction-to-case, max

Rth,j-c

°C/W

Thermal Resistance, Junction-to-ambient, max

Rth,j-a

45 (Note)

°C/W

Note : Surface mounted on 1 in² copper pad of FR-4 board; 120

°C/W when mounted on minimum copper pad

Characteristics (Tj=25

°C, unless otherwise specified)

Symbol

Min.

Typ.

Max.

Unit

Test Conditions

Static

BVDSS

-60

VGS=0, ID=-250μA

ΔBVDSS/ΔTj

-0.04

°C

Reference to 25

°C, ID=-1mA

VGS(th)

-1.0

-1.9

-2.5

VDS = VGS, ID=-250μA

GFS

VDS =-10V, ID=-3A

IGSS

100

VGS=±20

IDSS

-1

μA

VDS =-48V, VGS =0

IDSS

-25

μA

VDS =-48V, VGS =0, Tj=70

°C

100

VGS =-10V, ID=-2.4A

100

VGS =-10V, ID=-1.5A

VGS =-10V, ID=-0.75A

*RDS(ON)

120

mΩ

VGS =-4.5V, ID=-1.7A

Dynamic

*Qg

*Qgs

3.2

*Qgd

5.2

ID=-4.8A, VDS=-30V, VGS=-10V

*td(ON)

*tr

*td(OFF)

*tf

VDS=-30V, ID=-1A,VGS=-10V,

RG=6Ω

Ciss

939

Coss

Crss

VGS=0V, VDS=-25V, f=1MHz

Source-Drain Diode

*VSD

-1.2

IS=-2A, VGS=0V

*trr

*Qrr

IS=-4.8A, VGS=0, dI/dt=100A/μs

*Pulse Test : Pulse Width

≤300μs, Duty Cycle≤2%

Ordering Information

Device

Package

Shipping

Marking

MTP2955L3

SOT-223

(Pb-free lead plating package)

2500 pcs / Tape & Reel

2955

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