DS1743/DS1743P

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AC TEST CONDITIONS

Output Load:

100 pF + 1TTL Gate

Input Pulse Levels:

0.0 to 3.0V

Timing Measurement Reference Levels:

Input: 1.5V

Output: 1.5V

Input Pulse Rise and Fall Times: 5 ns

NOTES:

1. Voltages are referenced to ground.

2. Typical values are at 25

°C and nominal supplies.

3. Outputs are open.

active and inactive levels are opposite.

6. Data retention time is at 25

°C.

from the time power is first applied by the user.

8. Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering

techniques as long as temperatures as long as temperature exposure to the lithium energy source

contained within does not exceed +85

°C. Post-solder cleaning with water washing techniques is

acceptable, provided that ultrasonic vibration is not used.

In addition, for the PowerCap:

a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through

solder reflow oriented with the label side up (“live - bug”).

b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than

3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To

remove the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to

remove solder.