CYStech Electronics Corp.

Spec. No. : C339SF

Issued Date : 2003.06.16

Revised Date :2007.08.24

Page No. : 3/3

CSFR10XSF

CYStek Product Specification

SOD-123 Dimension

Marking Code:

Device CSFR

101

CSFR

102

CSFR

103

CSFR

104

Code

H1

H2

H3

H4

Device CSFR

105

CSFR

106

CSFR

107

Code

H5

H6

H7

SOD-123 Plastic Surface

Mounted Package

CYStek Package Code: SF

*:Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.138

0.154

3.5

3.9

E

0.051

0.067

1.3

1.7

B

0.055

0.071

1.4

1.8

F

0.035(typ)

0.9(typ)

C

0.012(typ)

0.3(typ)

G

0.035(typ)

0.9(typ)

D

0.110

0.126

2.8

3.2

-

-

-

-

-

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.