LMC6022IMSLASHNOPB datasheet(2/22 Pages) TI

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LMC6022

SNOS622D – NOVEMBER 1994 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

Differential Input Voltage

±Supply Voltage

Supply Voltage (V+

− V−)

16V

Lead Temperature (Soldering, 10 sec.)

260°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

ESD Tolerance(2)

1000V

Voltage at Output/Input Pin

(V+) +0.3V, (V−)

−0.3V

Current at Output Pin

±18 mA

Current at Power Supply Pin

35 mA

Power Dissipation

See(3)

Current at Input Pin

±5 mA

Output Short Circuit to V−

See(4)

Output Short Circuit to V+

See(5)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to component may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test

conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.

(2)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

(3)

The maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max) − TA)/θJA.

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature and/or

multiple Op Amp shorts can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30

mA over long term may adversely affect reliability.

(5)

Do not connect output to V+ when V+ is greater than 13V or reliability may be adversely affected.

OPERATING RATINGS

Temperature Range

−40°C ≤ TJ ≤ +85°C

Supply Voltage Range

4.75V to 15.5V

Power Dissipation

See(1)

Thermal Resistance (

θJA)

(2)

8-Pin SOIC

165°C/W

(1)

For operating at elevated temperatures the device must be derated based on the thermal resistance

θJA with PD = (TJ−TA)/θJA.

(2)

All numbers apply for packages soldered directly into a PC board.

DC ELECTRICAL CHARACTERISTICS

The following specifications apply for V

+ = 5V, V− = 0V, V

CM = 1.5V, VO = 2.5V, and RL = 1M unless otherwise noted.

Boldface limits apply at the temperature extremes; all other limits TJ = 25°C.

LMC6022I

Symbol

Parameter

Conditions

Typical(1)

Units

Limit(2)

VOS

Input Offset Voltage

max

ΔVOS/ΔT

Input Offset Voltage

2.5

μV/°C

Average Drift

Input Bias Current

0.04

200

max

IOS

Input Offset Current

0.01

100

max

RIN

Input Resistance

Tera

(1)

Typical values represent the most likely parametric norm.

(2)

All limits are guaranteed by testing or correlation.

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