OPA2822

2

SBOS188E

www.ti.com

Supply Voltage .................................................................................

±6.5V

Internal Power Dissipation ........................... See Thermal Characteristics

Differential Input Voltage ..................................................................

±1.2V

Input Voltage Range ............................................................................

±V

S

Storage Temperature Range ......................................... –65

°C to +125°C

Lead Temperature (SO-8) ............................................................. +260

°C

ESD Rating (Human Body Model) .................................................. 2000V

(Machine Model) ........................................................... 200V

NOTE: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those specified is not implied.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA2822U

SO-8 Surface-Mount

D

–40

°C to +85°C

OPA2822U

OPA2822U

Rails, 100

""

"

"

"

OPA2822U/2K5

Tape and Reel, 2500

OPA2822E

MSOP-8 Surface-Mount

DGK

–40

°C to +85°C

D22

OPA2822E/250

Tape and Reel, 250

""

"

"

"

OPA2822E/2K5

Tape and Reel, 2500

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.

ELECTROSTATIC

DISCHARGE SENSITIVITY

Electrostatic discharge can cause damage ranging from per-

formance degradation to complete device failure. Texas In-

struments recommends that all integrated circuits be handled

and stored using appropriate ESD protection methods.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet published speci-

fications.

Top View

SO

PIN CONFIGURATION / MSOP PACKING MARKING

MSOP PACKAGE MARKING

1

2

3

4

8

7

6

5

+V

S

Out B

–In B

+In B

Out A

–In A

+In A

–V

S

OPA2822

D22

8

765

1

234