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THS4081CD bảng dữ liệu(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
tên linh kiện THS4081CD
Giải thích chi tiết về linh kiện  175 MHz High Speed AMPLIFIERS
PDF  32 Pages
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nhà sản xuất  NSC [National Semiconductor (TI)]
Trang chủ  http://www.national.com
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THS4081CD bảng dữ liệu(HTML) 3 Page - National Semiconductor (TI)

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THS4081, THS4082
175MHz LOW POWER HIGHSPEED AMPLIFIERS
SLOS274D − DECEMBER 1999 − REVISED JUNE 2001
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC
±16.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI
±VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO
150 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VIO
±4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation
See Dissipation Rating Table
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature, TJ
150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature, TA: C-suffix
0
°C to 70°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I-suffix
−40
°C to 85°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
θJA
θJC
TA = 25°C
PACKAGE
θJA
(
°C/W)
θJC
(
°C/W)
TA = 25 C
POWER RATING
D
167‡
38.3
740 mW
DGN§
58.4
4.7
2.14 W
‡ This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed
High-K test PCB, the
θJA is 95°C/W with a power rating at TA = 25°C of 1.32 W.
§ This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in. × 3 in.
PC. For further information, refer to Application Information section of this data sheet.
recommended operating conditions
MIN
NOM
MAX
UNIT
Supply voltage, VCC+ and VCC−
Dual supply
±5
±15
V
Supply voltage, VCC+ and VCC−
Single supply
10
30
V
Operating free-air temperature, TA
C-suffix
0
70
°C
Operating free-air temperature, TA
I-suffix
−40
85
°C



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