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OPA890IDBVT bảng dữ liệu(PDF) 2 Page - National Semiconductor (TI) |
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OPA890IDBVT bảng dữ liệu(HTML) 2 Page - National Semiconductor (TI) |
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2 / 34 page ![]() 1 2 3 4 8 7 6 5 DIS +V S Output NC NC InvertingInput NoninvertingInput -VS TOPVIEW SO TOPVIEW SOT23 1 2 3 6 5 4 +V S DIS InvertingInput Output -VS NoninvertingInput 1 2 3 6 5 4 NC=NoConnection PinOrientation/PackageMarking BRI OPA890 SBOS369B – MAY 2007 – REVISED DECEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY OPA890ID Rail, 75 OPA890 SO-8 D –40°C to +85°C OPA890 OPA890IDR Tape and Reel, 2500 OPA890IDBVT Tape and Reel, 250 OPA890 SOT23-6 DBV –40°C to +85°C BRI OPA890IDBVR Tape and Reel, 3000 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). OPA890 UNIT Power Supply ±6.5 V Internal Power Dissipation See Thermal Characteristics Input Voltage Range ±VS V Storage Temperature Range –65 to +125 °C Maximum Junction Temperature (TJ) +150 °C Maximum Junction Temperature, Continuous Operation, Long-Term Reliability +140 °C Human Body Model (HBM) 2000 V ESD Rating: Charge Device Model (CDM) 1500 V Machine Model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. PIN CONFIGURATIONS 2 Submit Documentation Feedback Copyright © 2007–2009, Texas Instruments Incorporated Product Folder Link(s): OPA890 |
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