AD780

Data Sheet

Rev. F | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Values

36 V

TRIM Pin to Ground

36 V

TEMP Pin to Ground

36 V

Power Dissipation (25°C)

500 mW

Storage Temperature

−65°C to +150°C

Lead Temperature

(Soldering 10 sec)

300°C

Output Protection

Output safe for indefinite short to

ESD Classification

Class 1 (1000 V)

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

conditions above those indicated in the operational sections of

this specification is not implied. Exposure to absolute

maximum specifications for extended periods may affect device

reliability.

NC = NO CONNECT

AD780

TOP VIEW

(Not to Scale)

NC

1

TEMP

3

GND

4

2.5V/3.0V O/PSELECT

(NC OR GND)

NC

TRIM

8

7

6

5

Figure 2. Pin Configuration, 8-Lead PDIP and SOIC Packages

GND

TEMP

TRIM

2.5V/3.0V

O/P SELECT

GND

Figure 3. Die Layout

NOTES

Die Thickness: The standard thickness of Analog Devices

bipolar dice is 24 mil ± 2 mil.

Die Dimensions: The dimensions given have a tolerance of

±2 mil.

Backing: The standard backside surface is silicon (not plated).

Analog Devices does not recommend gold-backed dice for most

applications.

Edges: A diamond saw is used to separate wafers into dice, thus

providing perpendicular edges halfway through the die. In

contrast to scribed dice, this technique provides a more uniform

die shape and size. The perpendicular edges facilitate handling

(such as tweezer pickup), while the uniform shape and size

simplify substrate design and die attach.

Top Surface: The standard top surface of the die is covered by a

layer of glassivation. All areas are covered except bonding pads

and scribe lines.

Surface Metallization: The metallization to Analog Devices

bipolar dice is aluminum. Minimum thickness is 10,000 Å.

Bonding Pads: All bonding pads have a minimum size of

4.0 mil by 6.0 mil. The passivation windows have a minimum

size of 3.6 mil by 5.6 mil.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.