AD5686 datasheet(7/24 Pages) AD

7 / 24 page

Data Sheet

AD5696/AD5694

Rev. A | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 5.

Parameter

Rating

VDD to GND

−0.3 V to +7 V

VLOGIC to GND

−0.3 V to +7 V

VOUT to GND

−0.3 V to VDD + 0.3 V

VREF to GND

−0.3 V to VDD + 0.3 V

Digital Input Voltage to GND1

−0.3 V to VLOGIC + 0.3 V

SDA and SCL to GND

−0.3 V to +7 V

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

125°C

Reflow Soldering Peak Temperature,

Pb Free (J-STD-020)

260°C

ESD

Human Body Model (HBM)

3.5 kV

Field-Induced Charged Device

Model (FICDM)

1.5 kV

Excluding SDA and SCL.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages. This

value was measured using a JEDEC standard 4-layer board with

zero airflow. For the LFCSP package, the exposed pad must be

tied to GND.

Table 6. Thermal Resistance

Package Type

θJA

Unit

16-Lead LFCSP

°C/W

16-Lead TSSOP

112.6

°C/W

ESD CAUTION

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