Absolute Maximum Ratings

If MilitaryAerospace specified devices are required please contact the National Semiconductor Sales Office

Distributors for availability and specifications

(Note 5)

LM108LM208

LM308

Supply Voltage

g

20V

g

18V

Power Dissipation (Note 1)

500 mW

500 mW

Differential Input Current (Note 2)

g

10 mA

g

10 mA

Input Voltage (Note 3)

g

15V

g

15V

Output Short-Circuit Duration

Continuous

Continuous

Operating Temperature Range (LM108)

b

(LM208)

b

Storage Temperature Range

b

b

Lead Temperature (Soldering 10 sec)

DIP

260 C

260 C

H Package Lead Temp

(Soldering 10 seconds)

300 C

300 C

Soldering Information

Dual-In-Line Package

Soldering (10 seconds)

260 C

Small Outline Package

Vapor Phase (60 seconds)

215 C

Infrared (15 seconds)

220 C

See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product

Reliability’’ for other methods of soldering surface mount devices

ESD Tolerance (Note 6)

2000V

Parameter

Condition

LM108LM208

LM308

Units

Min

Typ

Max

Min

Typ

Max

Input Offset Voltage

07

20

20

75

mV

Input Offset Current

005

02

02

1

nA

Input Bias Current

08

20

15

7

nA

Input Resistance

3070

1040

MX

Supply Current

03

06

03

08

mA

Large Signal Voltage

50

300

25

300

VmV

Gain

Input Offset Voltage

30

10

mV

Average Temperature

Coefficient of Input

30

15

60

30

m

V C

Offset Voltage

Input Offset Current

04

15

nA

Average Temperature

Coefficient of Input

05

25

20

10

pA C

Offset Current

Input Bias Current

30

10

nA

Supply Current

015

04

mA

Large Signal Voltage

25

15

VmV

Gain

Output Voltage Swing

g

13

g

14

g

13

g

14

V

2