LP8900TLE-AAEB datasheet(3/17 Pages) TI1

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LP8900

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SNVS542C – MAY 2008 – REVISED JULY 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

VIN, VOUT Pins: Voltage to GND

-0.3 to 6.5V

VEN : Voltage to GND

-0.3 to (VIN + 0.3V) to 6.5V (max)

Junction Temperature

150°C

Lead/Pad Temp. (4)

DSBGA

260°C

Storage Temperature

-65 to 150°C

Continuous Power Dissipation (5)

Internally Limited

ESD (6)

Human Body Model

2KV

Machine Model

200V

(1)

All Voltages are with respect to the potential at the GND pin.

(2)

Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the

device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test

conditions, see the Electrical Characteristics tables.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

For further information on these packages please refer to the following application notes, AN-1112 (SNVA009) DSBGA Wafer Level

Chip Scale Package.

(5)

Internal thermal shutdown circuitry protects the device from permanent damage.

(6)

The human body model is 100 pF discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200pF capacitor

discharged directly into each pin.

OPERATING RATINGS

(1)

Input Voltage Range

1.8 to 5.5V

Recommended Load Current per channel

200mA

Junction Temperature

–40°C to 125°C

Ambient Temperature TA Range

(2)

–40°C to 85°C

(1)

Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the

device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125°C), the

maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part /

package in the application (

θJA), as given by the following equation: TA(max) = TJ(max-op) - (θJA × PD(max)).

THERMAL PROPERTIES

(1)

Junction To Ambient Thermal Resistance(2)

θJA JEDEC Board

(3)

108°C/W

θJA 4 Layer Board

172°C/W

(1)

Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the

device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power

dissipation is possible, special care must be paid to thermal dissipation issues in board design.

(3)

Full details can be found in JESD61-7

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