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ISO124P bảng dữ liệu(PDF) 3 Page - Burr-Brown (TI) |
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ISO124P bảng dữ liệu(HTML) 3 Page - Burr-Brown (TI) |
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3 / 12 page ![]() 3 ® ISO124 1 2 28 27 16 15 13 14 +V S1 –V S1 V OUT Gnd Gnd V IN –V S2 +V S2 Top View —P Package Top View—U Package CONNECTION DIAGRAM ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage ................................................................................... ±18V VIN ......................................................................................................±100V Continuous Isolation Voltage ..................................................... 1500Vrms Junction Temperature .................................................................... +150 °C Storage Temperature ....................................................................... +85 °C Lead Temperature (soldering, 10s) ................................................ +300 °C Output Short to Common ......................................................... Continuous NOTE: (1) Stresses above these ratings may cause permanent damage. PACKAGE INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) ISO124P 16-Pin Plastic DIP 238 ISO124U 28-Lead Plastic SOIC 217-1 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. 1 2 16 15 10 9 7 8 +V S1 –V S1 V OUT Gnd Gnd V IN –V S2 +V S2 ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NONLINEARITY PRODUCT PACKAGE MAX %FSR ISO124P 16-Pin Plastic DIP ±0.010 ISO124U 28-Lead Plastic SOIC ±0.010 ORDERING INFORMATION |
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