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TDA8024 bảng dữ liệu(PDF) 2 Page - List of Unclassifed Manufacturers

tên linh kiện TDA8024
Giải thích chi tiết về linh kiện  Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts C4, C7 and C8
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TDA8024 bảng dữ liệu(HTML) 2 Page - List of Unclassifed Manufacturers

  TDA8024 Datasheet HTML 1Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 2Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 3Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 4Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 5Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 6Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 7Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 8Page - List of Unclassifed Manufacturers TDA8024 Datasheet HTML 9Page - List of Unclassifed Manufacturers Next Button
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2004 July 12
2
Philips Semiconductors
Product specification
IC card interface
TDA8024
CONTENTS
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
ORDERING INFORMATION
5
QUICK REFERENCE DATA
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
Power supply
8.2
Voltage supervisor
8.2.1
Without external divider on pin PORADJ
(or with TDA8024AT)
8.2.2
With an external divider on pin PORADJ (not
for the TDA8024AT)
8.2.3
Application examples
8.3
Clock circuitry
8.4
I/O transceivers
8.5
Inactive mode
8.6
Activation sequence
8.7
Active mode
8.8
Deactivation sequence
8.9
VCC generator
8.10
Fault detection
9
LIMITING VALUES
10
HANDLING
11
THERMAL CHARACTERISTICS
12
CHARACTERISTICS
13
APPLICATION INFORMATION
14
PACKAGE OUTLINES
15
SOLDERING
15.1
Introduction to soldering surface mount
packages
15.2
Reflow soldering
15.3
Wave soldering
15.4
Manual soldering
15.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
16
DATA SHEET STATUS
17
DEFINITIONS
18
DISCLAIMERS



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