LT1129/LT1129-3.3/LT1129-5

13

112935ff

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

APPLICATIONS INFORMATION

F Package

20-Lead Plastic TSSOP (4.4mm)

(LTC DWG # 05-08-1650)

OBSOLETE PACKAGE

F20 TSSOP 0204

0.09 – 0.20

(.0035 – .0079)

0° – 8°

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50**

(.169 – .177)

13

4

5 6 7 89 10

11

12

14 13

6.40 – 6.60*

(.252 – .260)

20 19 18 17 16 15

1.10

(.0433)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

6.40

(.252)

BSC

0.19 – 0.30

(.0075 – .0118)

TYP

2

MILLIMETERS

(INCHES)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED .152mm (.006") PER SIDE

*

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

RECOMMENDED SOLDER PAD LAYOUT

0.45 ±0.05

0.65 BSC

4.50 ±0.10

6.60 ±0.10

1.05 ±0.10

Table 4. Fault Conditions

INPUT PIN

SHDN PIN

OUTPUT PIN

Open (Hi)

Reverse Output Current ≈ 15μA (See Figure 3)

Input Current ≈ 1μA (See Figure 4)

Grounded

Reverse Output Current ≈ 15μA (See Figure 3)

Input Current ≈ 1μA (See Figure 4)

Open

Open (Hi)

Reverse Output Current ≈ 15μA (See Figure 3)

Open

Grounded

Reverse Output Current ≈ 15μA (See Figure 3)

PACKAGE DESCRIPTION