AD845 datasheet(3/12 Pages) AD

3 / 12 page

AD845

REV. E

–3–

ORDERING GUIDE

Temperature

Package

Model

Range

Description

Option

AD845JN

∞C to 70∞C

8-Lead PDIP

N-8

AD845KN

∞C to 70∞C

8-Lead PDIP

N-8

AD845JR-16

∞C to 70∞C

16-Lead SOIC

R-16

AD845JR-16-REEL

∞C to 70∞CTape and Reel

R-16

AD845JR-16-REEL7

∞C to 70∞CTape and Reel

R-16

AD845AQ

–40

∞C to +85∞C

8-Lead CERDIP

Q-8

AD845BQ

–40

∞C to +85∞C

8-Lead CERDIP

Q-8

AD845SQ

–55

∞C to +125∞C

8-Lead CERDIP

Q-8

AD845SQ/883B

–55

∞C to +125∞C

8-Lead CERDIP

Q-8

5962-8964501PA

–55

∞C to +125∞C

8-Lead CERDIP

Q-8

AD845JCHIPS

∞C to 70∞CDie

NOTES

1N = Plastic DIP; Q = CERDIP; R = Small Outline IC (SOIC).

2See military data sheet.

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Internal Power Dissipation

Plastic Mini-DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.6 W

CERDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4 W

16-Lead SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5 W

Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +VS

Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite

Differential Input Voltage . . . . . . . . . . . . . . . . . . +VS and –VS

Storage Temperature Range

Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65

∞C to +150∞C

N, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65

∞C to +125∞C

Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300

∞C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only, and functional operation of

the device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2Mini-DIP package:

qJA = 100∞C/W; CERDIP package: qJA = 110∞C/W; SOIC

package:

qJA = 100∞C/W.

METALIZATION PHOTOGRAPH

Dimensions shown in inches and (mm).

Contact factory for latest dimensions.

SUBSTRATE CONNECTED TO +V

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