MICRF620Z datasheet(19/21 Pages) MICREL

19 / 21 page

Micrel, Inc.

MICRF620/MICRF620Z

July 2006

M9999-120205

Assembling the MICRF620

Recommended Reflow Temperature Profile

When the MICRF620 module is being automatically

assembled to a PCB, care must be taken not to expose

the module for temperature above the maximum specified.

Figure 13 shows the recommended reflow temperature

profile.

Figure 13. Recommended Reflow Temperature Reflow

Shock/Vibration during Reflow

The module has several components inside which are

assembled in a reflow process. These components may

reflow again when the module is assembled onto a PCB. It

is therefore important that the module is not subjected to

any mechanical shock or vibration during this process.

Handassembling the MICRF620

It is recommended to use solder paste also during hand

assembling of the module. Because of the module ground

pad on the bottom side, the module will be assembled

most efficient if the heat is being subjected to the bottom

side of the PCB. The heat will be transferred trough the

PCB due the ground vias under the module (see Layout

Considerations). In addition, it is recommended to use a

solder tip on the signal and power pads, to make sure the

solder points are properly melted.

Layout

Recommended Land Pattern

Figure 14 shows a recommended land pattern that

facilitates both automatic and hand assembling.

Figure 14. Recommended Land Pattern (TOP VIEW)

MICRF620Z bảng dữ liệu(PDF) 19 Page - Micrel Semiconductor