AS3658 datasheet(13/158 Pages) AMSCO

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AS3658

Data Sheet Confidential - Absolute Maximum rati ngs

5 Absolute Maximum ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 13 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Unit

Note

High voltage pins (VIN_HV)

-0.3

17.0

Applicable for high voltage pins

1. HV pins

VCHARGER, VGATE, VOFF_B, DCDC_CURR1, DCDC_CURR2, DCDC_CURR3

5V pins (VIN_MV)

-0.3

7.0

Applicable for pins 5V-pins

2. 5V pins are

V_USB, CH_SENSE_N, CH_SENSE_P, VSUP_SW1, VSUP_SW2, VBAT_SW1, VBAT_SW2, V_BAT, SCL,

SDA, XRESET, XINT, VSUPPLY_3, CURR1_GPIO1…CURR4_GPIO4, DCDC_GATE1, DCDC_GATE2,

DCDC_SENSE_P1, DCDCSENSE_P2, DCDC_SENSE_N1, DCDC_SENSE_N2, DCDC_FB1, DCDC_FB2,

VCL, VCP_OUT, VCP_N, VCP_P, VCP_IN, VCP_IN, VRF1, VREF1_IN, VRF2, VRF23_IN, VRF3, VDIG1,

VDIG1_IN, VDIG2, VDIG2_IN, VDIG34_IN, VDIG_3, VDIG_4, PGATE1 VSUPPLY_1, VSUPPLY_2, LX1, LX2,

GND_SW, VSUPPLY_4, LINE_CM, HP_CM_PWR, HP_CM, HPLx, HPRx, ALVDD, AVDD, LSP_R, BVSS,

LSP_L, AVDD, VSUPPLY_5, VSUPPLY_6

3.3V pins (VIN_LV)

-0.3

5.0

Applicable for 3.3V-Pins

3. 3.3V pins are

ISENSEP, ISENSEN, ADC_INx, RPROGRAM, V2_5, CREF, ON, VI2S, SDIx, SCLKx, MCLKx, LRCLKx,

SDOx, SPDIF, AGND, VREF, LINL,LINR, VDAC, Q32K, XIN32, XOUT32, VBACK, MICS, MICN, MICP

Input pin current (IIN)

-25

+25

At 25 ºC, Norm: Jedec 78

Storage Temperature Range

(Tstrg)

-55

125

ºC

Humidity

Noncondens

Electrostatic discharge 1kV (VESD)

-1000

1000

Norm: MIL 883 E Method 3015; Setup

Applicable for pins: all

4. The following pins are connected to ESD setup:

VSUPPLY_1...VSUPPLY_6, VCP_IN, VRF1_IN, VRF2_IN, VCURR connected together

VDIG1_IN, VDIG2_IN, VDIG34_IN connected together

AVDD, ALVDD connected together

VBAT_SW1 and VBAT_SW2 connected together

VSUP_SW1 and VSUP_SW2 connected together

All VSS connected together

Total Power Dissipation

TA = 70ºC

0.72

TA = 84ºC

Package Body Temperature

260

°C

IPC/JEDEC J-STD-020C, reflects moisture

sensitivity level only

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Solder Profile

5. austriamicrosystems strongly recommends to use underfill.

235

245

°C

TPEAK

DWell, above 217 °C

Moisture Sensitive Level

Represents a max. floor live time of 168h

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