PIC16F84A datasheet(304/337 Pages) MICROCHIP

304 / 337 page

PIC16C6X

DS30234D-page 304

25.14

Package Marking Information

Legend:

MM...M

XX...X

Microchip part number information

Customer speciﬁc information*

Year code (last 2 digits of calender year)

Week code (week of January 1 is week '01’)

Facility code of the plant at which wafer is manufactured.

C = Chandler, Arizona, U.S.A.

Mask revision number for microcontroller

Mask revision number for EEPROM

Assembly code of the plant or country of origin in which

part was assembled.

In the event the full Microchip part number cannot be marked on one

line, it will be carried over to the next line thus limiting the number of

available characters for customer speciﬁc information.

Note:

Standard OTP marking consists of Microchip part number, year code, week code,

facility code, mask revision number, and assembly code. For OTP marking beyond

this, certain price adders apply. Please check with your Microchip Sales Ofﬁce.

For QTP devices, any special marking adders are included in QTP price.

MMMMMMMMMMMMM

XXXXXXXXXXXXXXXX

AABBCDE

18-Lead PDIP

18-Lead SOIC

XXXXXXXXXXXX

AABBCDE

XXXXXXXXXXXX

MMMMMMMMMM

MMMMMM

XXXXXXXX

AABBCDE

18-Lead CERDIP Windowed

PIC16C61-04/P

9450CBA

Example

-20/SO

9449CBA

PIC16C61

/JW

9440CBT

Example

S = Tempe, Arizona, U.S.A.

XXXXXXXXXXXXXXXXX

AABBCAE

28-Lead PDIP (.300 MIL)

PIC16C63-04I/SP

9452CAN

Example

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