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AS1369 bảng dữ liệu(PDF) 4 Page - ams AG

tên linh kiện AS1369
Giải thích chi tiết về linh kiện  200mA Ultra-Compact Low Dropout Regulator
PDF  22 Pages
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AS1369 bảng dữ liệu(HTML) 4 Page - ams AG

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www.austriamicrosystems.com/LDOs/AS1369
Revision 1.7
3 - 21
AS1369
Datasheet - Absolute Maximum Rat i ngs
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
1
1. The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to direct light could
cause device malfunction.
Parameter
Min
Max
Units
Comments
Electrical Parameters
Input Supply Voltage
-0.3
+7
V
Shutdown Input Voltage
-0.3
+7
V
Output Voltage
-0.3
+7
V
IOUT
Short-circuit protected
Input/Output Voltage
2
2. The output PNP structure contains a diode between pins VIN and VOUT that is normally reverse-biased. reversing the polarity of pins
VIN and VOUT will activate this diode.
-0.3
+7
V
Latch-Up
-100
+100
mA
Norm: JEDEC 78
Electrostatic Discharge
ESD
2
kV
Norm: MIL 883 E method 3015
500
V
CDM JESD22-C101C methods
Temperature Ranges and Storage Conditions
Thermal Resistance,
JA
3
3. Exceeding the maximum allowable dissipation will cause excessive device temperature and the regulator will go into thermal shutdown.
345
ºC/W
The maximum allowable power dissipation is a function of the
maximum junction temperature (TJ(MAX), the junction-to-
ambient thermal resistance (
JA), and the ambient
temperature (TAMB). The maximum allowable power
dissipation at any ambient temperature is calculated as:
P(MAX) = (TJ(MAX) - (TAMB))/
JA
(EQ 1)
Where:
The value of
JA for the WLP package is 345°C/W.
Operating Junction Temperature
-40
+125
ºC
Storage Temperature Range
-65
+150
ºC
Package Body Temperature
+260
ºC
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.



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