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Revision 1.5

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AS1358 / AS1359

Datasheet - Absolute Maximum Rat i ngs

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

IN to GND

-0.3

+7

V

OUT, SHDNN to GND

-0.3

IN +0.3

V

BYPASS to GND

-0.3

OUT +0.3

V

Output Short-Circuit Duration

Infinite

Thermal Resistance

201.7

ºC/W

Junction-to-ambient thermal resistance is very dependent

on application and board-layout. In situations where high

maximum power dissipation exists, special attention must

be paid to thermal dissipation during board design.

Operating Temperature Range

-40

+85

ºC

Junction Temperature

+125

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-020D

“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).