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AOZ8000HI bảng dữ liệu(PDF) 2 Page - Alpha & Omega Semiconductors

tên linh kiện AOZ8000HI
Giải thích chi tiết về linh kiện  Plastic Encapsulated Device
PDF  4 Pages
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nhà sản xuất  AOSMD [Alpha & Omega Semiconductors]
Trang chủ  http://www.aosmd.com
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AOZ8000HI bảng dữ liệu(HTML) 2 Page - Alpha & Omega Semiconductors

  AOZ8000HI Datasheet HTML 1Page - Alpha & Omega Semiconductors AOZ8000HI Datasheet HTML 2Page - Alpha & Omega Semiconductors AOZ8000HI Datasheet HTML 3Page - Alpha & Omega Semiconductors AOZ8000HI Datasheet HTML 4Page - Alpha & Omega Semiconductors  
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This AOS product reliability report summarizes the qualification result for AOZ8000HI.
Review of the electrical test results confirm that AOZ8000HI pass AOS quality and reliability
requirements for product release. The continuous qualification testing and reliability monitoring
program ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I.
Product Description
II.
Package and Die information
III.
Qualification Test Requirements
IV.
Qualification Tests Result
V.
Quality Assurance Information
I. Product Description:
The AOZ8000HI is a transient voltage suppressor array designed to protect high speed data lines from ESD and
lightning. The product comes in RoHS compliant, SC70 package and is rated over a -40°C to +85°C ambient
temperature range.
.
Absolute Maximum Ratings
Parameter
VP-VN
6V
Peak Pulse Current (Ipp), tp=8/20uS
5A
Peak Power Dissipation (8x20mS@ 25°C)
SOT-23
50W
Storage Temperature (TS)
-65°C to +150°C
ESD Rating per IEC61000-4-2, contact
(1)
±12kV
ESD Rating per IEC61000-4-2, air
(2)
±15kV
ESD Rating per Human Body Model
(2)
±15kV
Junction Temperature (Tj)
-40°C to +125°C
Notes:
(1) IEC-61000-4-2 discharge with CDischarge=150pF, RDischarge=330Ω
(2) Human Body Discharge per MIL-STD-883, Method 3015 CDischarge=100pF, RDischarge=1.5kΩ
II. Package and Die Information:
Product ID
AOZ8000HI
Process
UMC 0.5um 5/18V 2P3M process
Package Type
SC70
Die
UE003A3 (size: 716 x 616 um)
L/F material
AgCu
Die attach material
Ablebond 8006NS
Die bond wire
Au, 1mil
Mold Material
CEL9220HF13
Plating Material
Pure Tin
III. Qualification Tests Requirments



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