See mechanical drawings for dimensions.

NC – No internal connection

DBV PACKAGE

(TOP VIEW)

2

5

3

4

Y

1

B

GND

A

V

CC

DCK PACKAGE

(TOP VIEW)

3

4

GND

2

B

Y

1

A

5

V

CC

DRL PACKAGE

(TOP VIEW)

2

B

1

A

3

4

GND

Y

5

V

CC

YZP PACKAGE

(BOTTOM VIEW)

2

B

1

A

GND

4

3

Y

5

V

CC

DRY PACKAGE

(TOP VIEW)

B

NC

A

6

5

4

2

3

GND

Y

V

CC

1

6

5

4

2

3

1

DSF PACKAGE

(TOP VIEW)

B

A

GND

NC

Y

V

CC

SN74LVC1G02

www.ti.com

SCES213S

– APRIL 1999 – REVISED MARCH 2011

SINGLE 2-INPUT POSITIVE NOR-GATE

Check for Samples: SN74LVC1G02

1

FEATURES

•

Available in the Texas Instruments NanoFree

™

•

Latch-Up Performance Exceeds 100 mA Per

Package

JESD 78, Class II

•

•

ESD Protection Exceeds JESD 22

•

Inputs Accept Voltages to 5.5 V

– 2000-V Human-Body Model (A114-A)

•

– 200-V Machine Model (A115-A)

•

Low Power Consumption, 10-

– 1000-V Charged-Device Model (C101)

•

±24-mA Output Drive at 3.3 V

•

Operation

DESCRIPTION/ORDERING INFORMATION

The SN74LVC1G02 performs the Boolean function Y = A + B or Y = A

• B in positive logic.

NanoFree

™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright

© 1999–2011, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.