Material Composition Specification

TLM364 Case

Device average mass . . . . . . . . . . . . . . . . . . . . 92 mg

Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . +/-10%

www.centr a lsemi.com

R0 (11-January 2012)

Component

Material

Material

Substance

CAS No.

Substance

(%wt)

(mg)

(%wt)

(mg)

(ppm)

active device

doped Si

10.41%

9.58

Si

7440-21-3

10.41%

9.58

104,130

clip

Cu alloy

5.36%

4.93

Cu

7440-50-8

5.21%

4.79

52,065

Fe

7439-89-6

0.15%

0.14

1,522

leadframe

Cu alloy

32.72%

30.1

Cu

7440-50-8

32.66%

30.05

326,630

Fe

7439-89-6

0.05%

0.05

543

die attach

high temperature

solder paste

4.52%

4.16

Pb

7439-92-1

4.18%

3.85

41,848

Sn

7440-31-5

0.23%

0.21

2,283

Ag

7440-22-4

0.11%

0.1

1,087

encapsulation*

EMC GREEN

46.98%

43.22

silica

60676-86-0

36.17%

33.28

361,739

epoxy resin

29690-82-2

4.70%

4.32

46,957

phenol resin

9003-35-4

4.55%

4.19

45,543

carbon black

1333-86-4

0.14%

0.13

1,413

metal

hydroxide

1309-42-8

1.41%

1.3

14,130

plating

matte tin

0.01%

0.01

Sn

7440-31-5

0.01%

0.01

109

*EMC GREEN molding compound is Halogen Free.

Disclaimer

The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no

guarantee to completeness or accuracy, as some information is derived from data sources outside the company.