Material Composition Specification

SMC Case

Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.5 mg

Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%

www.centra lsemi.com

R5 (3-June 2011)

Component

Material

Material

Substance CAS No.

Substance

(%wt)

(mg)

(%wt)

(mg)

(ppm)

active device

doped Si

1.63%

3.8

Si

7440-21-3

1.63%

3.8

16,344

leadframe

copper

39.11%

90.92

Cu

7440-50-8

39.11%

90.92

391,054

die attach

high temperature

solder paste

1.88%

4.36

Pb

7439-92-1

1.73%

4.033

17,346

Sn

7440-31-5

0.09%

0.218

938

Ag

7440-22-4

0.05%

0.109

469

encapsulation*

EMC

56.77%

132

silica

7631-86-9

38.61%

89.76

386,065

epoxy resin

29690-82-2

11.35%

26.4

113,548

phenol resin

9003-35-4

5.68%

13.2

56,774

Sb2O3

1309-64-4

0.57%

1.32

5,677

Br

7726-95-6

0.57%

1.32

5,677

EMC GREEN

56.77%

132

silica (fused) 60676-86-0

43.72%

101.64

437,161

epoxy resin

29690-82-2

5.68%

13.2

56,774

phenol resin

9003-35-4

5.51%

12.804

55,071

carbon black

1333-86-4

0.17%

0.396

1,703

metal

hydroxide

1309-42-8

1.7%

3.96

17,032

plating**

tin/lead process

0.61%

1.42

Sn

7440-31-5

0.49%

1.136

4,886

Pb

7439-92-1

0.12%

0.284

1,222

matte tin

0.61%

1.42

Sn

7440-31-5

0.61%

1.42

6,108

*EMC GREEN molding compound is Halogen-Free.

**For Lead Free plating, add suffix “LEAD FREE” to part number.

For Tin/Lead plating, add suffix “TIN/LEAD” to part number.

No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.

Disclaimer

The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no

guarantee to completeness or accuracy, as some information is derived from data sources outside the company.