TLK2541

www.ti.com

SLLS779B

– JANUARY 2008 – REVISED APRIL 2008

DISSIPATION RATINGS

(1)

DERATING FACTOR

POWER RATING

POWER RATING

5.01 W

42.9 mW/

°C

2.69 W

(1)

This data was taken using 2 oz trace and copper pad that is soldered directly to a JEDEC standard 4 layer 3 in

× 3 in PCB.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

Standard JEDEC High-K board.

For more information, refer to TI application note PowerPAD

™ Thermally Enhanced package, TI literature

number SLMA002.

ELECTRICAL CHARACTERISTICS

over recommended operating conditions

PARAMETER

TEST CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage

2.3

2.5

2.7

V

Frequency = 1.25 Gbps, PRBS pattern

280

Supply current

mA

Frequency = 2.5 Gbps, PRBS pattern

310

Frequency = 1.25 Gbps, PRBS pattern

700

Power dissipation

Frequency = 2.5 Gbps, PRBS pattern

775

mW

825

Low Power Mode current

1

mA

PLL startup lock time

0.1

0.4

ms

Data acquisition time

Frequency = 1.25 Gbps or 2.5 Gbps, K28.5 D16.2

256

ns

pattern (3 sigma values)

Operating free-air temperature

–40

85

°C

(1)

Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.

REFERENCE CLOCK (REFCLK)TIMING REQUIREMENTS

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Frequency

Minimum data rate

Typ

–0.01%

100

Typ+0.01%

MHz

Frequency

Maximum data rate

Typ

–0.01%

130

Typ+0.01%

MHz

Frequency tolerance

–100

100

ppm

Duty cycle

40%

50%

60%

Jitter

Peak-to-peak

40

ps

© 2008, Texas Instruments Incorporated

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