OUT

8

6

1

IN−

IN+

2

3

Null

−

+

1OUT

1IN−

1IN+

2OUT

2IN−

2IN+

8

6

1

2

3

5

7

4

−

+

−

+

THS4031

THS4032

www.ti.com

SLOS224G – JULY 1999 – REVISED MARCH 2010

FUNCTIONAL BLOCK DIAGRAMS

Figure 1. THS4031 – Single Channel

Figure 2. THS4032 – Dual Channel

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

VALUE

UNIT

33

V

Input voltage

Output current

150

mA

Differential input voltage

±4

V

Continuous total power dissipation

See Dissipation Ratings Table

C-suffix

0 to 70

Operating free-air

I-suffix

–40 to 85

°C

temperature

M-suffix

–55 to 125

Maximum junction temperature, (any condition)

150

°C

130

°C

Storage temperature

–65 to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package

300

°C

Case temperature for 60 seconds, FK package

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device. Does not apply to the JG package or FK package.

DISSIPATION RATINGS TABLE

PACKAGE

(°C/W)

(°C/W)

POWER RATING

D

38.3

58.4

4.7

JG

119

28

FK

87.7

20

(1)

(2)

This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in. × 3-in. PC. For further information, refer to

Application Information section of this data sheet.

Copyright © 1999–2010, Texas Instruments Incorporated

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