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THS3001IDR bảng dữ liệu(PDF) 24 Page - Texas Instruments |
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THS3001IDR bảng dữ liệu(HTML) 24 Page - Texas Instruments |
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24 / 39 page ![]() P D + T MAX –T A q JA Where: PD = Maximum power dissipation of THS3001 (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature ( °C) θJA = Thermal coefficient from die junction to ambient air (°C/W) TA − Free-Air Temperature − °C 1 0 −20 20 1.5 0.5 0 40 100 −40 60 80 SOIC-D Package: θJA = 169°C/W TJ = 150°C No Airflow THS3001 SLOS217H – JULY 1998 – REVISED SEPTEMBER 2009................................................................................................................................................. www.ti.com THERMAL INFORMATION The THS3001 incorporates output-current-limiting protection. Should the output become shorted to ground, the output current is automatically limited to the value given in the data sheet. While this protects the output against excessive current, the device internal power dissipation increases due to the high current and large voltage drop across the output transistors. Continuous output shorts are not recommended and could damage the device. Additionally, connection of the amplifier output to one of the supply rails (±VCC) is not recommended. Failure of the device is possible under this condition and should be avoided. But, the THS3001 does not incorporate thermal-shutdown protection. Because of this, special attention must be paid to the device's power dissipation or failure may result. The thermal coefficient θJA is approximately 169°C/W for the SOIC 8-pin D package. For a given θJA, the maximum power dissipation, shown in Figure 55, is calculated by the following formula: Figure 55. Maximum Power Dissipation vs Free-Air Temperature 24 Submit Documentation Feedback Copyright © 1998–2009, Texas Instruments Incorporated Product Folder Link(s): THS3001 |
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