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HVLED815PF bảng dữ liệu(PDF) 8 Page - STMicroelectronics |
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HVLED815PF bảng dữ liệu(HTML) 8 Page - STMicroelectronics |
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8 / 36 page ![]() Pin description and connection diagrams HVLED815PF 8/36 Doc ID 023409 Rev 4 2.2 Thermal data 3VCC Supply voltage of the device. A capacitor, connected between this pin and ground, is initially charged by the internal high-voltage startup generator; when the device is running, the same generator keeps it charged in case the voltage supplied by the auxiliary winding is not sufficient. This feature is disabled in case a protection is tripped. A small bypass capacitor (100 nF typ.) to GND may be useful to get a clean bias voltage for the signal part of the IC. 4GND Ground. Current return for both the signal part of the IC and the gate drive. All of the ground connections of the bias components should be tied to a trace going to this pin and kept separate from any pulsed current return. 5ILED Constant current (CC) regulation loop reference voltage. An external capacitor CLED is connected between this pin and GND. An internal circuit develops a voltage on this capacitor that is used as the reference for the MOSFET’s peak drain current during CC regulation. The voltage is automatically adjusted to keep the average output current constant. 6DMG Transformer demagnetization sensing for quasi-resonant operation and output voltage monitor. A negative-going edge triggers the MOSFET turn-on, to achieve quasi-resonant operation (zero voltage switching). The pin voltage is also sampled-and-held right at the end of transformer demagnetization to get an accurate image of the output voltage to be fed to the inverting input of the internal, transconductance-type, error amplifier, whose non- inverting input is referenced to 2.5 V. The maximum IDMG sunk/sourced current must not exceed ± 2 mA (AMR) in all the Vin range conditions. No capacitor is allowed between the pin and the auxiliary transformer. 7COMP Output of the internal transconductance error amplifier. The compensation network is placed between this pin and GND to achieve stability and good dynamic performance of the voltage control loop. 8 N.a. Not available. These pins must be connected to GND. 9-11 N.a. Not available. These pins must be left not connected. 12 N.c. Not internally connected. Provision for clearance on the PCB to meet safety requirements. 13 to 16 DRAIN Drain connection of the internal power section. The internal high-voltage startup generator sinks current from this pin as well. Pins connected to the internal metal frame to facilitate heat dissipation. Table 2. Pin description (continued) N. Name Function Table 3. Thermal data Symbol Parameter Max. value Unit RthJP Thermal resistance, junction-to-pin 10 °C/W RthJA Thermal resistance, junction-to-ambient 110 °C/W |
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