LWH1035N_13 datasheet(13/21 Pages) LUXPIA

13 / 21 page

12/20

(Ver 1.0)

9. Reliability

9.1. test items and results

no.

test item

Standard

Test

Method

Test Conditions

Note

number of

damaged

sample

resistance to soldering

heat

(reflow)

JESD22-B106

Tsld=260oC, 10sec

(pre treatment

60oC,90%,24hrs)

2 times

0/45

solderability

(reflow)

EIAJED4701-200

JESD22-B102

Tsld=215±5oC, 3sec

1 time

over 95%

0/45

temperature cycle

EIAJED4701-100

JESD22-A104

-40oC through +25oC to

+100℃

(30min/5min/30min)

100 cycles

0/45

high temperature

storage

EIAJED4701-200

JESD22-A103

Ta=100℃

1000 hrs

0/45

high humidity and

temperature storage

EIAJED4701-200

JESD22-A101

Ta=60 , RH=90%

℃

1000 hrs

0/45

low temperature storage

EIAJED4701-200

JESD22-A103

Ta=-40℃

1000 hrs

0/45

steady-state operating

lifetime test

MIL-STD-883E

JESD22-A108

Ta=25 , I

℃ F=30mA

500 hrs

0/45

steady-state operating

lifetime of high

temperature

MIL-STD-883E

JESD22-A108

Ta=85 , I

℃ F=7.5mA

1000 hrs

0/45

steady-state operating

lifetime of high humidity

and temperature

Ta=60 , RH=90%,

℃

IF=20mA

500 hrs

0/45

steady-state operating

lifetime of low

temperature

MIL-STD-810F

JESD22-A108

Ta=-30 , I

℃ F=20mA

1000 hrs

0/45

* LED with Luxpia standard circuit board

9.2. criteria for judging the damage

criteria for judgement

item

symbol

test condition

min

max

forward voltage

IF = 20mA

U.S.L.5) × 1.1

luminous intensity

IF = 20mA

L.S.L.6) × 0.7

5) U.S.L. : upper standard level

6) L.S.L. : lower standard level

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